IC PACKAGING FAIR 2026

International specialized exhibition of information and communication technologies

from 27 to 29 of October

Shenzhen WECC view map | Shenzhen, China

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IC PACKAGING FAIR 2026

Less than 4 months left until the opening

A trade show for industry professionals!

Visitors
Always a target audience!
IC PACKAGING FAIR 2026

The exhibition IC PACKAGING FAIR is a unique platform for professionals in the field of electronic design and components, as well as applied computer and industrial engineering. Participating in this exhibition opens up numerous opportunities for establishing business contacts, sharing experiences, and exploring the latest technologies in the field of packaging and testing electronics.

At the IC PACKAGING FAIR, you will be able to familiarize yourself with modern equipment for laminating, soldering, and testing, which will not only enhance your knowledge but also help you find solutions to increase the efficiency of your business. The exhibition gathers leading industry players, creating an ideal environment for forming partnerships and collaborations.

Don't miss the chance to be part of this significant event! The exhibition IC PACKAGING FAIR takes place only once a year, and each time it attracts many participants from different countries. This is a great opportunity to showcase your developments and services, demonstrate them to a wide audience, and receive feedback from experts.

Participation in the IC PACKAGING FAIR will give you access to the latest advancements and trends in the field of electronics packaging, helping you stay competitive in the market. Join in and open new horizons for your business!



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IC PACKAGING FAIR 2026
 Location IC PACKAGING FAIR 2026

Participants
Leading industry enterprises!

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IC PACKAGING FAIR 2026

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Less than 4 months left until the opening

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