IC & Sensor Packaging Technology Expo 2026
International specialized exhibition of information and communication technologies
Exhibition for industry professionals!
Visitors
Always a target audience!
We invite you to participate in the International Exhibition of Equipment and Materials for the Assembly, Mounting, Packaging, and Sealing of Integrated Circuits and Electronic Devices. This event is part of a large integrated project that includes several specialized exhibitions covering all key aspects of the microelectronics industry.
The IC Packaging exhibition will showcase the complete technology for the industrial production of high-reliability and high-density casings for integrated circuits. Visitors will have the opportunity to explore advanced solutions in assembly and design, as well as modern equipment, materials, and technologies, including molding, stamping, dies, and techniques for soldering, welding, and sealing. Participants will be presented with the latest liquid sealants, adhesives, resins, and conductive connections, along with systems for testing and inspection.
Additionally, the event will feature a series of other exhibitions, such as robotics, portable devices and technologies, equipment for LED production, and a showcase dedicated to modern automotive technologies.
Don’t miss the chance to be part of this significant event in the world of microelectronics and technology. Join the exhibition and discover new horizons in your professional field!
Countries
Wide geography of participants!
The IC Packaging exhibition will showcase the complete technology for the industrial production of high-reliability and high-density casings for integrated circuits. Visitors will have the opportunity to explore advanced solutions in assembly and design, as well as modern equipment, materials, and technologies, including molding, stamping, dies, and techniques for soldering, welding, and sealing. Participants will be presented with the latest liquid sealants, adhesives, resins, and conductive connections, along with systems for testing and inspection.
Additionally, the event will feature a series of other exhibitions, such as robotics, portable devices and technologies, equipment for LED production, and a showcase dedicated to modern automotive technologies.
Don’t miss the chance to be part of this significant event in the world of microelectronics and technology. Join the exhibition and discover new horizons in your professional field!
Countries
Wide geography of participants!
Location IC & Sensor Packaging Technology Expo 2026
Participants
Leading industry enterprises!
Less than 3 months left until the opening
You may be interested in exhibitions:
-
InterPackExpo 2025
Tashkent
,
from 18 to 20 of November
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Exhibition subjects
Location
Superb
Thematic sections of the exhibition
IC & Sensor Packaging Technology Expo 2026
Containers and packaging
Packaging, Plastic box, Packaging materials, Labels, Packaging production machines and equipment, Packaging design and construction, Raw materials for production of packaging materials, Materials and technologies for printing labels, Bar coding equipment, Paper, cardboard, boxes, ...
Packaging, Plastic box, Packaging materials, Labels, Packaging production machines and equipment, Packaging design and construction, Raw materials for production of packaging materials, Materials and technologies for printing labels, Bar coding equipment, Paper, cardboard, boxes, ...
