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IC & Sensor Packaging Technology Expo 2025

Exhibition

from 22 to 24 of January

Y Excenter view map | Tokyo, Japan

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IC & Sensor Packaging Technology Expo 2025

Less than 1 month left until the opening

Exhibition for industry professionals!

Visitors
Always a target audience!
IC & Sensor Packaging Technology Expo 2025
Thematic sections of the exhibition

Containers and packaging
  • Packaging
  • Plastic box
  • Packaging materials
  • Labels
  • Packaging production machines and equipment
  • Packaging design and construction
  • Raw materials for production of packaging materials
  • Materials and technologies for printing labels
  • Bar coding equipment
  • Paper, cardboard, boxes
  • Gift wrap
  • Corrugated paper
  • Packing services
  • Packaging for transportation
  • Packaging automation
  • Marking and marking equipment
  • Package recycling
  • Printing on packaging
  • Aluminum packaging
  • Cachepot, pots, vases, trays
  • Labeling and marking equipment


Countries
Wide geography of participants!

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 Location IC & Sensor Packaging Technology Expo 2025
Booking.com

Participants
Leading industry enterprises!

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