IC & Sensor Packaging Technology Expo 2026
International specialized exhibition of information and communication technologies
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InterPackExpo 2026
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Tashkent
,
from 17 to 19 of November
Tashkent
,
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About the last trade show IC & Sensor Packaging Technology Expo 2026
Visitors
Always a target audience!
We invite you to participate in the International Exhibition of Equipment and Materials for the Assembly, Mounting, Packaging, and Sealing of Integrated Circuits and Electronic Devices. This event is part of a large integrated project that includes several specialized exhibitions covering all key aspects of the microelectronics industry.
The IC Packaging exhibition will showcase the complete technology for the industrial production of high-reliability and high-density casings for integrated circuits. Visitors will have the opportunity to explore advanced solutions in assembly and design, as well as modern equipment, materials, and technologies, including molding, stamping, dies, and techniques for soldering, welding, and sealing. Participants will be presented with the latest liquid sealants, adhesives, resins, and conductive connections, along with systems for testing and inspection.
Additionally, the event will feature a series of other exhibitions, such as robotics, portable devices and technologies, equipment for LED production, and a showcase dedicated to modern automotive technologies.
Don’t miss the chance to be part of this significant event in the world of microelectronics and technology. Join the exhibition and discover new horizons in your professional field!
Countries
Wide geography of participants!
![IC & Sensor Packaging Technology Expo 2026]( "IC & Sensor Packaging Technology Expo 2026")
The IC Packaging exhibition will showcase the complete technology for the industrial production of high-reliability and high-density casings for integrated circuits. Visitors will have the opportunity to explore advanced solutions in assembly and design, as well as modern equipment, materials, and technologies, including molding, stamping, dies, and techniques for soldering, welding, and sealing. Participants will be presented with the latest liquid sealants, adhesives, resins, and conductive connections, along with systems for testing and inspection.
Additionally, the event will feature a series of other exhibitions, such as robotics, portable devices and technologies, equipment for LED production, and a showcase dedicated to modern automotive technologies.
Don’t miss the chance to be part of this significant event in the world of microelectronics and technology. Join the exhibition and discover new horizons in your professional field!
Countries
Wide geography of participants!
Location IC & Sensor Packaging Technology Expo 2026
Participants
Leading industry enterprises!
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" Containers and packaging "